IP Library › Assignment 055899/0610
Patent Assignment
Reel/Frame 055899/0610

Assignment of Assignor's Interest

Recorded: 2021-04-13 Pages: 4
Assignors
WADA, YUICHI
Executed: 2019-06-13
KESAPRAGADA, SREE RANGASAI V
Executed: 2019-06-09
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Methods and Apparatus for Cleaving of Semiconductor Substrates
Application: 17/227,354 →
Publication: US 2021/0233802
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 13, 2021
From: DENG, FELIX; OW, YUEH SHENG; KOH, TUCK FOONG; CHEN, NUNO YEN-CHU
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 055899/0705 →
Assignment of Assignor's Interest Oct 7, 2021
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 057726/0648 →