Patent Assignment
Reel/Frame 055929/0308
Assignment of Assignor's Interest
Recorded: 2021-04-15
Pages: 9
Assignors
LEN, MICHAEL
Executed: 2019-06-06
MEI, CHONG
Executed: 2019-03-15
LUGERT, MICHAEL
Executed: 2019-06-10
KUMAR, RAJ
Executed: 2019-06-10
Assignee
TTM TECHNOLOGIES INC.
200 EAST SANDPOINTE, SUIE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
Methods for Fabricating Printed Circuit Board Assemblies with High Density via Array
Application:
17/225,491 →
Publication:
US 2021/0227695
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →