Patent Assignment
Reel/Frame 055958/0363
Assignment of Assignor's Interest
Recorded: 2021-04-19
Pages: 3
Assignor
AUSSERLECHNER, UDO
Executed: 2021-04-14
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Device Comprising a Chip Package and an Overlap-Free Coil Layout