IP Library › Assignment 055960/0837
Patent Assignment
Reel/Frame 055960/0837

Assignment of Assignor's Interest

Recorded: 2021-04-19 Pages: 4
Assignors
CHEN, SZU-YING
Executed: 2021-03-31
SYUE, SEN-HONG
Executed: 2021-03-31
WANG, LI-TING
Executed: 2021-04-01
CHANG, HUICHENG
Executed: 2021-04-05
YEO, YEE-CHIA
Executed: 2021-04-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Device and Method of Forming Same
Application: 17/186,293 →
Publication: US 2022/0278097