IP Library › Assignment 055961/0154
Patent Assignment
Reel/Frame 055961/0154

Assignment of Assignor's Interest

Recorded: 2021-04-19 Pages: 2
Assignor
SHIMIZU, KAZUKI
Executed: 2021-04-08
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
72-34, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property (1)
Semiconductor Device and Method for Manufacturing Semiconductor Device
Application: 17/276,560 →
Publication: US 2022/0005748
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 16, 2025
From: KABUSHIKI KAISHA TOSHIBA; TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 071978/0946 →