Patent Assignment
Reel/Frame 055962/0557
Assignment of Assignor's Interest
Recorded: 2021-04-19
Pages: 2
Assignor
HONG, JOO WAN
Executed: 2021-04-12
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Heat Dissipation Layer