Patent Assignment
Reel/Frame 055981/0948
Change of Name
Recorded: 2021-04-20
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Polishing Liquid, Polishing Liquid Set, and Substrate Polishing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 16, 2018
From: AKUTSU, TOSHIAKI; MINAMI, HISATAKA; MINAMI, TOMOHIRO; YAMASHITA, TETUSRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 046359/0280 →
Corrective Assignment to Correct the Third and Fourth Inventor Names Previously Recorded at Reel: 046359 Frame: 0280. Assignor(S) Hereby Confirms the Assignment .
Jul 20, 2018
From: AKUTSU, TOSHIAKI; MINAMI, HISATAKA; IWANO, TOMOHIRO; YAMASHITA, TETSURO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 046597/0328 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →