Patent Assignment
Reel/Frame 055986/0986
Assignment of Assignor's Interest
Recorded: 2021-04-21
Pages: 14
Assignors
MITSUISHI, HAJIME
Executed: 2021-03-04
SUGAYA, ISAO
Executed: 2021-03-01
TSUNODA, MASAKI
Executed: 2021-03-29
SUZUKI, KAZUHIRO
Executed: 2021-03-01
SHIOMI, TAKASHI
Executed: 2021-03-01
FUKUDA, MINORU
Executed: 2021-03-02
Assignee
NIKON CORPORATION
15-3, KONAN 2-CHOME, MINATO-KU, TOKYO, 108-6290, JAPAN
Covered Property
(1)
Substrate Bonding Device, Calculation Device, Substrate Bonding Method, and Calculation Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.