Patent Assignment
Reel/Frame 073244/0044
Assignment of Assignor's Interest
Recorded: 2025-12-17
Pages: 5
Assignor
NIKON CORPORATION
Executed: 2025-12-11
Assignee
SCREEN HOLDINGS CO., LTD.
1-1, TENJINKITA-MACHI, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI, KAMIGYO-KU, KYOTO-SHI, KYOTO, 602-8585, JAPAN
Covered Properties
(6)
Substrate Bonding Apparatus and Substrate Bonding Method
Application:
18/474,731 →
Publication:
US 2024/0014079
Substrate Bonding Device, Calculation Device, Substrate Bonding Method, and Calculation Method
Alignment Method and Alignment Apparatus
Bonding Method and Bonding Device
Control Device, Control Method, and Program
Bonding Method, Bonding Device, and Holding Member
Application:
18/785,246 →
Publication:
US 2024/0387177
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 20, 2020
From: MITSUISHI, HAJIME; FUKUDA, MINORU; SUGAYA, ISAO
To: NIKON CORPORATION
Reel/Frame 053556/0812 →
Assignment of Assignor's Interest
Jan 25, 2021
From: MAEHARA, YOSHIHIRO; KAMASHITA, ATSUSHI; MITSUISHI, HAJIME; FUKUDA, MINORU
To: NIKON CORPORATION
Reel/Frame 055012/0120 →
Assignment of Assignor's Interest
Apr 21, 2021
From: MITSUISHI, HAJIME; SUGAYA, ISAO; TSUNODA, MASAKI; SUZUKI, KAZUHIRO
To: NIKON CORPORATION
Reel/Frame 055986/0986 →
Assignment of Assignor's Interest
Nov 7, 2022
From: MAEDA, HIDEHIRO; SHIMODA, TOSHIMASA; MITSUISHI, HAJIME; MORI, HIROSHI
To: NIKON CORPORATION
Reel/Frame 061673/0086 →
Assignment of Assignor's Interest
Jul 26, 2024
From: MITSUISHI, HAJIME; SUGAYA, ISAO; FUKUDA, MINORU; TSUNODA, MASAKI
To: NIKON CORPORATION
Reel/Frame 068097/0519 →