Patent Assignment
Reel/Frame 055993/0478
Assignment of Assignor's Interest
Recorded: 2021-04-21
Pages: 5
Assignors
SU, HUAN-CHIEH
Executed: 2020-07-27
YU, LI-ZHEN
Executed: 2020-07-27
CHEN, CHUN-YUAN
Executed: 2020-07-27
CHUANG, CHENG-CHI
Executed: 2020-07-27
CHENG, KUAN-LUN
Executed: 2020-08-05
WANG, CHIH-HAO
Executed: 2020-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and Structure for Reducing Source/Drain Contact Resistance at Wafer Backside