Patent Assignment
Reel/Frame 056056/0194
Assignment of Assignor's Interest
Recorded: 2021-04-27
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2020-09-01
PAN, KUO LUNG
Executed: 2020-09-01
KUO, TIN-HAO
Executed: 2020-09-04
TSAI, HAO-YI
Executed: 2020-09-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Method