Patent Assignment
Reel/Frame 056059/0084
Assignment of Assignor's Interest
Recorded: 2021-04-27
Pages: 5
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2020-08-29
KATKAR, RAJESH
Executed: 2020-08-24
WORKMAN, THOMAS
Executed: 2020-08-31
GAO, GUILIAN
Executed: 2020-08-24
FOUNTAIN JR., GAIUS GILLMAN
Executed: 2020-08-24
MIRKARIMI, LAURA WILLS
Executed: 2020-09-17
HABA, BELGACEM
Executed: 2020-08-24
GUEVARA, GABRIEL Z.
Executed: 2020-08-28
WATANABE, JOY
Executed: 2020-08-24
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct Bonded Stack Structures for Increased Reliability and Improved Yield in Microelectronics
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →