Patent Assignment
Reel/Frame 056064/0652
Assignment of Assignor's Interest
Recorded: 2021-04-27
Pages: 4
Assignors
FUJIWARA, HIDEHIRO
Executed: 2020-04-23
LIAO, HUNG-JEN
Executed: 2020-04-23
WANG, LI-WEN
Executed: 2020-04-23
CHANG, JONATHAN TSUNG-YUNG
Executed: 2020-04-28
CHEN, YEN-HUEI
Executed: 2020-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Device Including Distributed Write Driving Arrangement