Patent Assignment
Reel/Frame 056108/0555
Assignment of Assignor's Interest
Recorded: 2021-05-02
Pages: 3
Assignee
RF360 SINGAPORE PTE. LTD
166 KALLANG WAY, SINGAPORE, 349249, SINGAPORE
Covered Property
(1)
Three-Dimensional (3D) Integration of Chip Components in an Electric Device
Application:
16/772,301 →
Publication:
US 2021/0082876
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.