ELECTRIC DEVICE WITH TWO OR MORE CHIP COMPONENTS

1 . An electric device, comprising:

a substrate (SU)

a recess (RC) in the top surface of the substrate

a buried chip component (BC) mounted to the bottom surface of the recess (RC)

a top chip component (TC), mounted to the top surface of the substrate to cover at least to some extend the recess (RC) and the buried chip component (BC)

device pads (PD) arranged on the bottom surface of the substrate and being electrically interconnected with one or both of the chip components (BC,TC).

2 . The electric device of claim 1 ,

wherein the substrate (SU) is a PCB, a multi-layer wiring board made of ceramic or laminate, comprising a wiring layer electrically interconnected to the chip components (BC,TC) and the device pads (PD).

3 . The electric device of claim 1 ,

comprising at least a second top chip component (TC 2 ) arranged adjacent to the first top chip component (TC 1 ) on the top surface of the substrate (SU), and/or at least a second buried chip component (BC 2 ) arranged adjacent to the first buried chip component on the bottom surface of the recess.

4 . The electric device of claim 1 ,

wherein a protection layer (PL) is applied to cover the upper surface of the one or more top chip components (TC) and the surrounding top surface of the substrate (SU), thereby sealing to the top surface with the recess and top and the buried chip components being arranged in a sealed cavity enclosed between protection layer and the substrate.

5 . The electric device of claim 1 ,

comprising a mold applied over the protection layer.

6 . The electric device of claim 1 ,

wherein the chip components are independently chosen from active or passive components, an IC, an acoustic wave component, a SAW device, a BAW device, a MEMS device and an RF filter device.

7 . The electric device of claim 1 ,

wherein the protection layer comprises a lamination foil chosen from a plastic film or a coated plastic film.

8 . The electric device of one of claim 1 ,

wherein the at least one top chip component is mounted to top contact pads arranged on the top surface near and along the edges of the recess

wherein the at least one buried chip component is mounted to bottom contact pads arranged on the bottom surface of the recess

wherein electrical interconnects of the top chip component to the top contact pads and of the buried chip component to the bottom contact pads are made by SMT interconnect, solder bumps, stud bumps, copper pillars or an electrically conductive adhesive.

9 . The electric device of claim 1 ,

the height of the recess and the height of the second interconnects (IN T ) are chosen to leave a gap between top surface of buried chip component (BC) and the bottom surface of the top chip component (TC) mounted above.