Patent Assignment
Reel/Frame 056108/0558
Assignment of Assignor's Interest
Recorded: 2021-05-02
Pages: 6
Assignor
RF360 SINGAPORE PTE. LTD.
Executed: 2017-09-06
Assignee
RF360 EUROPE GMBH
ANZINGER STR. 13, MUNICH, 81671, GERMANY
Covered Property
(1)
Three-Dimensional (3D) Integration of Chip Components in an Electric Device
Application:
16/772,301 →
Publication:
US 2021/0082876
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.