Patent Assignment
Reel/Frame 056120/0652
Assignment of Assignor's Interest
Recorded: 2021-05-03
Pages: 4
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2021-03-17
TENG, LI-FENG
Executed: 2021-03-17
WU, WEI-CHENG
Executed: 2021-03-17
CHU, FANG-LAN
Executed: 2021-04-21
KAO, YA-CHEN
Executed: 2021-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD.6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Manufacturing Method Thereof