Patent Assignment
Reel/Frame 056140/0897
Assignment of Assignor's Interest
Recorded: 2021-05-05
Pages: 4
Assignors
JUNG, JINHEE
Executed: 2021-05-05
KIM, CHANGOH
Executed: 2021-05-05
LEE, HEESOO
Executed: 2021-05-05
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Embedding Circuit Pattern in Encapsulant for SIP Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.