Patent Assignment
Reel/Frame 056172/0502
Assignment of Assignor's Interest
Recorded: 2021-05-07
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2021-05-03
CHEN, MING-FA
Executed: 2021-05-03
YEH, SUNG-FENG
Executed: 2021-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method