Patent Assignment
Reel/Frame 056183/0048
Assignment of Assignor's Interest
Recorded: 2021-05-10
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2021-05-06
CHEN, HSIEN-WEI
Executed: 2021-05-06
YEH, SUNG-FENG
Executed: 2021-05-06
CHEN, JIE
Executed: 2021-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, CHINA
Covered Property
(1)
Semiconductor Packages with Stacked Dies and Methods of Forming the Same