Patent Assignment
Reel/Frame 056185/0779
Assignment of Assignor's Interest
Recorded: 2021-05-10
Pages: 6
Assignors
LEE, KEUNHYUK
Executed: 2014-10-06
JEON, OSEOB
Executed: 2014-10-13
SON, JOON-SEO
Executed: 2014-10-13
IM, SEUNGWON
Executed: 2014-10-13
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
55, PYEONGCHEON-RO 850 BEON-GIL, WONMI-GU, BUCHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Power Module Package and Method of Manufacturing the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 10, 2021
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056202/0896 →
Security Interest
Aug 2, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 057054/0706 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest in Patents Recorded at Reel 057054, Frame 0706
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064083/0001 →