Patent Assignment
Reel/Frame 056202/0896
Assignment of Assignor's Interest
Recorded: 2021-05-10
Pages: 46
Assignor
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
Executed: 2017-11-02
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Power Module Package and Method of Manufacturing the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 10, 2021
From: LEE, KEUNHYUK; JEON, OSEOB; SON, JOON-SEO; IM, SEUNGWON
To: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
Reel/Frame 056185/0779 →
Security Interest
Aug 2, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 057054/0706 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest in Patents Recorded at Reel 057054, Frame 0706
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064083/0001 →