IP Library Assignment 056206/0631
Patent Assignment
Reel/Frame 056206/0631

Assignment of Assignor's Interest

Recorded: 2021-05-11 Pages: 3
Assignor
SAKAI, TOMOKI
Executed: 2021-05-10
Assignee
TAIYO YUDEN CO., LTD.
7-19 KYOBASHI 2-CHOME, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property (1)
Method of Producing a Multi-Layer Ceramic Electronic Component, Multi-Layer Ceramic Electronic Component, and Circuit Board
Application: 17/317,735 →
Publication: US US20210366657A1