Method of producing a multi-layer ceramic electronic component, multi-layer ceramic electronic component, and circuit board
A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.
1. A multi-layer ceramic electronic component, comprising:
a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and
an external electrode including
a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material,
a first nickel film disposed on the base film, and
a second nickel film disposed on the first nickel film,
wherein the second nickel film has a higher hydrogen concentration than the first nickel film.
2. The multi-layer ceramic electronic component according to claim 1 , wherein
the first nickel film has a thickness of 1.0 μm or more and 10.0 μm or less.
3. The multi-layer ceramic electronic component according to claim 1 , wherein
the second nickel film has a thickness of 1.5 μm or more and 6.0 μm or less.
4. The multi-layer ceramic electronic component according to claim 1 , wherein
the base film has a thickness of 2 μm or more and 50 μm or less.
5. The multi-layer ceramic electronic component according to claim 1 , wherein
the base film includes copper or an alloy thereof as a main component.
6. The multi-layer ceramic electronic component according to claim 1 , wherein
the external electrode further includes
a superficial film disposed on the second nickel film and including tin or an alloy thereof as a main component.
7. A circuit board, comprising:
a mount board;
the multi-layer ceramic electronic component according to claim 1 ; and
a solder that connects the external electrode and the mount board to each other.
8. A multi-layer ceramic electronic component, comprising:
a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and
an external electrode including
a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material,
a first nickel film disposed on the base film, and
a second nickel film disposed on the first nickel film,
wherein the first nickel film includes a recrystallized structure.
9. A circuit board, comprising:
a mount board;
the multi-layer ceramic electronic component according to claim 8 ; and
a solder that connects the external electrode and the mount board to each other.
10. A multi-layer ceramic electronic component, comprising:
a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and
an external electrode including
a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material,
a first nickel film disposed on the base film, and
a second nickel film disposed on the first nickel film,
wherein the second nickel film has more lattice defects than the first nickel film.
11. A circuit board, comprising:
a mount board;
the multi-layer ceramic electronic component according to claim 10 ; and
a solder that connects the external electrode and the mount board to each other.