IP Library Assignment 056221/0658
Patent Assignment
Reel/Frame 056221/0658

Assignment of Assignor's Interest

Recorded: 2021-05-11 Pages: 239
Assignor
CREE, INC.
Executed: 2021-03-01
Assignee
CREELED, INC.
4400 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties (2)
Light-Emitting Diode Packages with Individually Controllable Light-Emitting Diode Chips
Application: 16/118,762 →
Publication: US 2019/0363232
Light-Emitting Diode Chip Structures
Application: 16/542,458 →
Publication: US 2021/0050482
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 2018
From: MURTHY, ROSHAN; DAVIS, KENNETH M.; PARK, JAE-HYUNG; SHI, XIAMENG
To: CREE, INC.
Reel/Frame 047664/0413 →
Assignment of Assignor's Interest Aug 21, 2019
From: BREVA, LUIS; STUART, COLIN; CHECK, MICHAEL
To: CREE, INC.
Reel/Frame 050114/0955 →
Security Interest Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001 Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →