Patent Assignment
Reel/Frame 056235/0575
Assignment of Assignor's Interest
Recorded: 2021-05-13
Pages: 3
Assignor
CHEN, CHI-HAN
Executed: 2021-05-06
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Optoelectronic Device Package and Method of Manufacturing the Same