Patent Assignment
Reel/Frame 056245/0491
Assignment of Assignor's Interest
Recorded: 2021-05-14
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2012-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Making Package Including Stress Relief Structures and Package