Granted Patent B2

US 12,543,571 · App. 17/320,721 · Granted Feb 3, 2026

Inventor: Hsien-Wei Chen (Hsinchu, TW)

Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD

H01L23/562H01L23/16H01L25/0655H01L23/5384H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/3511

Abstract

Claims (43)

1 . A package comprising:

a substrate;

a first die on the substrate;

a second die on the substrate;

a first stress relief structure on the substrate, wherein a distance between the first stress relief structure to the first die is a first distance;

a second stress relief structure on the substrate, wherein a distance between the second stress relief structure and the second die is the first distance, and the second stress relief structure is separated from the first stress relief structure; and

a third stress relief structure between the first die and the second die, wherein the third stress relief structure comprises a first portion extending along a first direction parallel to an edge of the first die, the first portion is between the first die and the second die, the first portion extends between the first die and the second die for less than an entirety of a length of the first die in the first direction, and the third stress relief structure is between the first die and the first stress relief structure.

2 . The package of claim 1 , further comprising a third die on the substrate, wherein the third die is separate from the first die and the second die.

3 . The package of claim 2 , wherein the third die has a different size from both the first die and the second die.

4 . The package of claim 2 , wherein a distance between the third die and a closest stress relief structure is a second distance different from the first distance.

5 . The package of claim 2 , wherein the third die is between the first die and the third stress relief structure.

6 . The package of claim 2 , wherein the first die is larger than the third die.

7 . The package of claim 1 , wherein the first stress relief structure is along a single edge of the substrate, and the second stress relief structure extends along multiple edges of the substrate.

8 . The package of claim 1 , wherein the second stress relief structure extends along two edges of the substrate.

9 . A package comprising:

a first die having a first size;

a second die having a second size less than the first die;

a third die having a third size different from the first size and the second size;

a fourth die having a fourth size different from the first size, the second size and the third size;

a first stress relief structure adjacent to a first corner of the first die;

a second stress relief structure adjacent to a second corner of the first die, wherein, in a plan view, each of the first stress relief structure and the second stress relief structure extends in a direction parallel to a side of the first die and parallel to a side of the second die, each of the first stress relief structure and the second stress relief structure is between the first die and the second die, and the first stress relief structure is separated from the second stress relief structure;

a third stress relief structure, wherein the third stress relief structure comprises:

a first portion between the first die and the second die,

a second portion between the first die and the third die,

a third portion between the second die and the fourth die, and

a fourth portion between the third die and the fourth die; and

a stiffener ring, wherein the stiffener ring is continuous, and the stiffener ring surrounds the first die and the second die.

10 . The package of claim 9 , wherein the first stress relief structure is between the fourth die and the third die.

11 . The package of claim 9 , wherein the third stress relief structure is adjacent to a third corner of the first die, wherein the third stress relief structure is between the first die and the third die.

12 . The package of claim 9 , wherein the third stress relief structure is adjacent to a third corner of the first die, wherein the third stress relief structure is between the first die and the stiffener ring.

13 . A package comprising:

a substrate;

a first die on the substrate;

a second die on the substrate;

a first stress relief structure on the substrate, wherein the first stress relief structure extends along a first edge of the substrate and a second edge of the substrate, a distance between the first stress relief structure along the first edge to the first die is a first distance, and a distance between the first stress relief structure along the second edge to the first die is the first distance; and

a second stress relief structure between the first die and the second die, wherein the second stress relief structure extends along a first direction parallel to an edge of the first die, and the second stress relief structure occupies less than an entirety of a space between the first die and the second die in the first direction.

14 . The package of claim 13 , wherein a distance between the second stress relief structure and the second die is the first distance, and the second stress relief structure is separated from the first stress relief structure.

15 . The package of claim 14 , wherein the second stress relief structure is along the second edge of the substrate.

16 . The package of claim 14 , wherein the second stress relief structure is along the first edge of the substrate.

17 . The package of claim 14 , further comprising a third stress relief structure on the substrate, wherein the second stress relief structure is between the first stress relief structure and the third stress relief structure, and the second stress relief structure is separated from the third stress relief structure.

18 . The package of claim 13 , wherein the first edge is perpendicular to the second edge.

19 . The package of claim 13 , further comprising a third die on the substrate, wherein the third die is separated from the first die and the second die.

20 . The package of claim 13 , wherein a size of the first die is different from a size of the second die.

Assignments (1)

Continuity (5)

References Cited (73)