IP Library › Assignment 056246/0738
Patent Assignment
Reel/Frame 056246/0738

Assignment of Assignor's Interest

Recorded: 2021-05-14 Pages: 43
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-11-19
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12/03, 248373, SINGAPORE
Covered Property (1)
Electronic Device Having a Substrate-to-Substrate Interconnection Structure and Manufacturing Method Thereof
Application: 17/320,759 →
Publication: US 2021/0313300
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 14, 2021
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 056303/0568 →
Assignment of Assignor's Interest Oct 5, 2022
From: PARK, JUNG SOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 061315/0293 →