Patent Assignment
Reel/Frame 061315/0293
Assignment of Assignor's Interest
Recorded: 2022-10-05
Pages: 6
Assignor
PARK, JUNG SOO
Executed: 2022-09-26
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties
(3)
Semiconductor Device Utilizing an Adhesive to Attach an Upper Package to a Lower Die
Electronic Device Having a Substrate-to-Substrate Interconnection Structure and Manufacturing Method Thereof
Electronic Device Having a Substrate-to-Substrate Interconnection Structure and Manufacturing Method Thereof
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 6, 2016
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 039918/0125 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest
Oct 16, 2020
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 054101/0866 →
Assignment of Assignor's Interest
Oct 16, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 054092/0248 →
Assignment of Assignor's Interest
May 14, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 056246/0738 →
Assignment of Assignor's Interest
May 14, 2021
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 056303/0568 →