IP Library Assignment 056303/0568
Patent Assignment
Reel/Frame 056303/0568

Assignment of Assignor's Interest

Recorded: 2021-05-14 Pages: 5
Assignors
PARK, JOON YOUNG
Executed: 2016-05-09
YOON, JI HYE
Executed: 2016-05-10
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Electronic Device Having a Substrate-to-Substrate Interconnection Structure and Manufacturing Method Thereof
Application: 17/320,759 →
Publication: US 2021/0313300
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 14, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 056246/0738 →
Assignment of Assignor's Interest Oct 5, 2022
From: PARK, JUNG SOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 061315/0293 →