IP Library › Assignment 039918/0125
Patent Assignment
Reel/Frame 039918/0125

Assignment of Assignor's Interest

Recorded: 2016-09-06 Pages: 5
Assignors
PARK, JOON YOUNG
Executed: 2016-05-09
YOON, JI HYE
Executed: 2016-05-10
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Device Utilizing an Adhesive to Attach an Upper Package to a Lower Die
Application: 15/148,747 →
Publication: US 2017/0323868
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest Oct 5, 2022
From: PARK, JUNG SOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 061315/0293 →