Patent Assignment
Reel/Frame 056247/0366
Assignment of Assignor's Interest
Recorded: 2021-05-14
Pages: 6
Assignors
KIM, CHEONBAE
Executed: 2021-03-17
KIM, SEUNGJIN
Executed: 2021-03-17
LEE, DONGKYUN
Executed: 2021-03-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same