Patent Assignment
Reel/Frame 056249/0185
Assignment of Assignor's Interest
Recorded: 2021-05-14
Pages: 4
Assignors
WANG, CHIN-HUA
Executed: 2019-01-22
LIN, PO-YAO
Executed: 2019-01-22
HSU, FENG-CHENG
Executed: 2019-01-22
JENG, SHIN-PUU
Executed: 2019-01-22
LIN, WEN-YI
Executed: 2019-01-22
YEH, SHU-SHEN
Executed: 2019-01-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Package