IP Library Assignment 056260/0246
Patent Assignment
Reel/Frame 056260/0246

Assignment of Assignor's Interest

Recorded: 2021-05-17 Pages: 2
Assignor
GUO, YI
Executed: 2021-04-26
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
Covered Property (1)
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Reduction
Application: 17/241,399 →
Publication: US 2022/0348788
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →