Patent Assignment
Reel/Frame 056269/0299
Assignment of Assignor's Interest
Recorded: 2021-05-18
Pages: 3
Assignors
KUO, CHIEN-LI
Executed: 2021-05-13
KAO, CHIN-FU
Executed: 2021-05-13
CHEN, CHEN-SHIEN
Executed: 2021-05-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Package Having Metal Thermal Interface Material and Method for Forming the Same