Patent Assignment
Reel/Frame 056281/0139
Assignment of Assignor's Interest
Recorded: 2021-05-18
Pages: 4
Assignors
YEH, CHE-YU
Executed: 2021-04-27
LIN, TSUNG-SHU
Executed: 2021-04-27
WU, WEI-CHENG
Executed: 2021-05-02
CHEN, TSUNG-YU
Executed: 2021-04-27
HSU, LI-HAN
Executed: 2021-04-27
TSENG, CHIEN-FU
Executed: 2021-04-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stacked via Structure Disposed on a Conductive Pillar of a Semiconductor Die