Patent Assignment
Reel/Frame 056314/0140
Assignment of Assignor's Interest
Recorded: 2021-05-21
Pages: 3
Assignor
LEE, TZE-LIANG
Executed: 2021-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Features With Sharp Corners and Method Forming Same