Patent Assignment
Reel/Frame 056329/0607
Assignment of Assignor's Interest
Recorded: 2021-05-24
Pages: 3
Assignors
WANG, SUNG-LI
Executed: 2018-11-28
TSAI, PANG-YEN
Executed: 2018-11-28
OKUNO, YASUTOSHI
Executed: 2018-11-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having Cap Layer