Patent Assignment
Reel/Frame 056366/0931
Assignment of Assignor's Interest
Recorded: 2021-05-27
Pages: 4
Assignors
HUANG, YEN-HAO
Executed: 2021-05-06
CHEN, CHUN-YI
Executed: 2021-05-01
WANG, I-SHI
Executed: 2021-05-24
CHOU, YIN-TUN
Executed: 2021-05-03
CHI, YUAN-HSIN
Executed: 2021-05-10
LIN, SHENG-YUAN
Executed: 2021-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(2)
Semiconductor Substrate Bonding Tool and Methods of Operation
Wafer Bonding Tool and Methods of Operation
Application:
63/200,511 →