IP Library › Patent Application 63200511
Patent Application Provisional
App. No. 63/200,511 · Confirmation No. 2355

WAFER BONDING TOOL AND METHODS OF OPERATION

Provisional Application Expired
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 Code Description Pages PDF
2021-05-27 OATH Oath or Declaration filed 4 View
2021-05-04 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2021-04-30 N417 Electronic Filing System Acknowledgment Receipt 2 View
2021-04-30 PA.. Power of Attorney 2 View
2021-04-07 APP.FILE.REC Filing Receipt 3 View
2021-03-11 SPEC Specification 2 View
2021-03-11 CLM Claims 1 View
2021-03-11 ADS Application Data Sheet 10 View
2021-03-11 TRAN.LET Transmittal Letter 1 View
2021-03-11 APPENDIX Appendix to the specification 6 View
2021-03-11 N417 Electronic Filing System Acknowledgment Receipt 3 View
2021-03-11 N417.PYMT Electronic Fee Payment 2 View
2021-03-11 SPEC Specification — View
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Quick Facts
App. No.
63/200,511
Filed
2021-03-11