Patent Assignment
Reel/Frame 056383/0040
Assignment of Assignor's Interest
Recorded: 2021-05-28
Pages: 4
Assignors
TSENG, TING-CHEN
Executed: 2021-05-27
LIAO, SIH-HAO
Executed: 2021-05-27
HU, YU-HSIANG
Executed: 2021-05-27
KUO, HUNG-JUI
Executed: 2021-05-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming Same