Patent Assignment
Reel/Frame 056388/0270
Assignment of Assignor's Interest
Recorded: 2021-05-28
Pages: 4
Assignors
PENG, SHIH-WEI
Executed: 2021-05-27
HSIAO, CHIH-MIN
Executed: 2021-05-27
CHANG, CHING-HSU
Executed: 2021-05-27
TZENG, JIANN-TYNG
Executed: 2021-05-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Diagonal via Pattern and Method