IP Library Assignment 056404/0701
Patent Assignment
Reel/Frame 056404/0701

Assignment of Assignor's Interest

Recorded: 2021-06-01 Pages: 3
Assignor
THEIL, JEREMY ALFRED
Executed: 2019-04-15
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Method for Preparing a Surface for Direct-Bonding
Application: 17/335,833 →
Publication: US 2021/0287910
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 1, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 062903/0425 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →