IP Library › Assignment 056446/0214
Patent Assignment
Reel/Frame 056446/0214

Assignment of Assignor's Interest

Recorded: 2021-06-04 Pages: 4
Assignors
HOU, SHANG-YUN
Executed: 2021-05-24
CHEN, WEIMING CHRIS
Executed: 2021-05-27
TING, KUO-CHIANG
Executed: 2021-05-24
HU, HSIEN-PIN
Executed: 2021-06-03
CHIOU, WEN-CHIH
Executed: 2021-05-24
YU, CHEN-HUA
Executed: 2021-05-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Chiplet Interposer
Application: 17/339,745 →
Publication: US 2022/0262742