Patent Assignment
Reel/Frame 056488/0897
Assignment of Assignor's Interest
Recorded: 2021-06-09
Pages: 5
Assignors
JUNG, JIN-SAN
Executed: 2021-04-28
CHOI, HYUNSEOK
Executed: 2021-04-28
LIM, JUN-SU
Executed: 2021-04-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Stage Structure for Semiconductor Fabrication Process, System of Picking Up Semiconductor Chip, and Method of Controlling Tilting Angle of Pickup Head