Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head

1. A stage structure for a semiconductor fabrication process, comprising:

a stage; and

a pickup head tilting control device,

wherein the pickup head tilting control device comprises;

an inclination correction plate,

a tilting driver, coupled to the inclination correction plate and configured to adjust an inclination angle of the inclination correction plate, and

a control processing circuitry configured to control the tilting driver;

wherein the inclination correction plate comprises a correction surface which is selectively in contact with a suction surface of a pickup head,

wherein the pickup head is configured to selectively contact the correction surface by moving downwardly to fully contact the inclination correction plate, and

the tilting driver of the pickup head tilting control device is configured to adjust the inclination angle of the inclination correction plate to change an inclination angle of the suction surface in response to the inclination correction plate contacting the suction surface.

2. The stage structure of claim 1 , wherein the tilting driver comprises a vertically extendible actuator,

the actuator is coupled to a supporting surface which is opposite to the correction surface, and

the control circuitry is configured to change a length of the actuator.

3. The stage structure of claim 2 , wherein the actuator comprises a Piezo actuator.

4. The stage structure of claim 2 , wherein a number of the actuator provided in the tilting driver is three or more.

5. The stage structure of claim 1 , wherein the inclination correction plate comprises at least one of ceramic materials and metallic materials.

6. The stage structure of claim 1 , wherein the stage has a recess portion defined by a partially recessed side surface, and

the inclination correction plate is in the recess portion.

7. The stage structure of claim 1 , further comprising

a measurement sensor, which is placed above the stage and is configured to measure an inclination angle of a semiconductor chip on the stage,

wherein the control circuitry is configured to control the tilting driver, based on information obtained by the measurement sensor.

8. The stage structure of claim 1 , further comprising a heater in the inclination correction plate.

9. The stage structure of claim 1 , wherein the correction surface is at a same level as a top surface of the stage.

10. The stage structure of claim 1 , wherein the stage is separate from the pickup head tilting control device.

11. The stage structure of claim 1 , wherein the inclination angle of the inclination correction plate is a horizontal inclination angle.

12. The stage structure of claim 1 , wherein the pickup head tilting control device is at one of an edge of the stage or a corner of the stage.

13. The stage structure of claim 1 , wherein the suction surface of the pickup head is configured to attach to a semiconductor chip.

14. The stage structure of claim 13 , wherein the pickup head includes a ball-and-socket joint, and the pickup head is configured to attach to a surface of the ball-and-socket joint.

15. The stage structure of claim 1 , further comprising:

a second pickup head tilting control device, wherein the second pickup head tilting control device is at a side of the stage other than a side of the stage where the pickup head tilting control device is located.

16. The stage structure of claim 1 , wherein the correction surface is configured to impart an upward force on the suction surface such that the pickup head is rotated.