Patent Assignment
Reel/Frame 056506/0958
Assignment of Assignor's Interest
Recorded: 2021-06-11
Pages: 3
Assignors
TSAI, HAO-YI
Executed: 2021-05-07
LIU, TZUAN-HORNG
Executed: 2021-05-04
HWANG, CHIEN-LING
Executed: 2021-05-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof