Patent Assignment
Reel/Frame 056522/0982
Assignment of Assignor's Interest
Recorded: 2021-06-12
Pages: 5
Assignors
LEE, SHAO-KUAN
Executed: 2021-05-25
YANG, KUANG-WEI
Executed: 2021-05-25
TSAI, CHERNG-SHIAW
Executed: 2021-05-27
LEE, CHENG-CHIN
Executed: 2021-06-08
LO, TING-YA
Executed: 2021-05-28
TENG, CHI-LIN
Executed: 2021-05-25
HUANG, HSIN-YIN
Executed: 2021-05-25
CHANG, HSIAO-KANG
Executed: 2021-05-25
SHUE, SHAU-LIN
Executed: 2021-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Interconnection Structure and Methods of Forming the Same