Patent Assignment
Reel/Frame 056550/0172
Assignment of Assignor's Interest
Recorded: 2021-06-15
Pages: 6
Assignors
MURAKAMI, NORIAKI
Executed: 2021-05-17
UCHIMURA, RYOICHI
Executed: 2021-05-19
OSE, MASAHISA
Executed: 2021-05-18
OHHASHI, KENICHI
Executed: 2021-05-18
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Laminate, Printed Wiring Board, Semiconductor Package, and Method for Manufacturing Laminate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.